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钎焊金刚石线锯切割单晶硅材料时的断裂行为研究 被引量:4

Failure modes of brazed diamond wire saw for slicing monocrystalline silicon material
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摘要 利用铜基钎料钎焊制备小直径金刚石线锯,观察线锯形貌,测试线锯力学性能,并在不同切割参数下对单晶硅材料进行切割,记录观察切割过程中的线锯受力,观察线锯断口形貌,探讨小直径钎焊金刚石线锯线锯过程中断裂行为及断裂机理。研究结果表明,线锯的断裂主要有正常疲劳断裂和非正常拉断。 Brazed diamond wire saw was used to cut monocrystalline silicon material at different processing parameters.The solder layer and fracture morphology of wire saw were observed.Combined with the theoretical analysis of wire saw force,the failure modes and mechanism were discussed.Experimental results showed that the failure of the brazed diamond wire saw could be divided into normal failure and abnormal failure modes.The normal failure meaned the fatigue fracture of a wire saw,while the abnormal failure meaned the accidental breakage of the wire saw because of inappropriate cutting parameters.
出处 《金刚石与磨料磨具工程》 CAS 2014年第4期6-10,共5页 Diamond & Abrasives Engineering
基金 国家自然科学基金青年项目(51005026) 安徽省优秀青年人才项目(2011SQRL163)
关键词 钎焊线锯 受力分析 疲劳断裂 brazed diamond wire saw force analysis fatigue fracture
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参考文献7

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二级参考文献31

共引文献35

同被引文献25

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