摘要
采用数值模拟的方法,在立式连续电镀模型中引入绝缘挡板,以此来改善目前实际生产中存在的镀层边缘较厚的问题。对绝缘挡板的三个参数分别设置不同的数值进行模拟,分析镀层厚度的变化趋势。解释了这些变化产生的原因,找出当前模型中的最优解,理论上可将误差从无绝缘挡板时的71.7%降低至13.3%。
An insulating shield was introduced into the vertical continuous electroplating model by using numerical simulation method for solving the problem of thicker coating edge existing in current practical production.The three parameters of the insulating shield were simulated by setting different figures to analyze the variation trend of coating thickness.The reasons for these changes were explained and the optimal solution in the current model was found; theoretically the error can be reduced from 71.7 ％without insulating shield to 13.3 ％.
出处
《电镀与环保》
CAS
CSCD
北大核心
2014年第5期15-18,共4页
Electroplating & Pollution Control
关键词
电镀
均匀性
数值模拟
绝缘挡板
电流密度
electroplating
uniformity
numerical simulation
insulating shield
current density
