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Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials 被引量:5

Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials
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摘要 The present paper is exposed theoretically to the influence on the dynamic stress intensity factor (DSIF) in the piezoelectric bi-materials model with two symmet- rically permeable interracial cracks near the edges of a circular cavity, subjected to the dynamic incident anti-plane shearing wave (SH-wave). An available theoretical method to dynamic analysis in the related research field is provided. The formulations are based on Green's function method. The DSIFs at the inner and outer tips of the left crack are obtained by solving the boundary value problems with the conjunction and crack- simulation technique. The numerical results are obtained by the FORTRAN language program and plotted to show the influence of the variations of the physical parameters, the structural geometry, and the wave frequencies of incident wave on the dimensionless DSIFs. Comparisons with previous work and between the inner and outer tips are con- cluded. The present paper is exposed theoretically to the influence on the dynamic stress intensity factor (DSIF) in the piezoelectric bi-materials model with two symmet- rically permeable interracial cracks near the edges of a circular cavity, subjected to the dynamic incident anti-plane shearing wave (SH-wave). An available theoretical method to dynamic analysis in the related research field is provided. The formulations are based on Green's function method. The DSIFs at the inner and outer tips of the left crack are obtained by solving the boundary value problems with the conjunction and crack- simulation technique. The numerical results are obtained by the FORTRAN language program and plotted to show the influence of the variations of the physical parameters, the structural geometry, and the wave frequencies of incident wave on the dimensionless DSIFs. Comparisons with previous work and between the inner and outer tips are con- cluded.
出处 《Applied Mathematics and Mechanics(English Edition)》 SCIE EI 2014年第10期1261-1270,共10页 应用数学和力学(英文版)
基金 supported by the National Natural Science Foundation of China(No.51108113)
关键词 symmetrically interfacial crack piezoelectric bi-material Green's function dynamic stress intensity factor (DSIF) dynamic anti-plane shearing wave (SH-wave) symmetrically interfacial crack, piezoelectric bi-material, Green's function,dynamic stress intensity factor (DSIF), dynamic anti-plane shearing wave (SH-wave)
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