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TH-1169无溶剂高纯度环氧浸渍树脂的性能研究

Properties of TH-1169 Solvent-free High-purity Epoxy Impregnating Resin
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摘要 通过改性高纯度环氧树脂,以特种潜伏性固化剂代替部分酸酐制备了单组份TH-1169无溶剂低粘度环氧浸渍树脂,并对其进行常规性能测试。结果表明:该树脂具有优异的贮存稳定性能、耐热性能、力学性能及电气绝缘性能。 A one-component TH-1169 solvent-free epoxy impregnating resin with low viscosity was prepared by modified high-purity epoxy resin and a special latent curing agent which replace pars of anhydride, and its conventional properties were tested. The results show that the impregnating resin has excellent storage stability, heat resistance, mechanical properties and electrical insulating properties.
出处 《绝缘材料》 CAS 北大核心 2014年第5期27-29,共3页 Insulating Materials
关键词 单组份 环氧 浸渍树脂 无溶剂 低挥发 储存稳定性 介质损耗因数 one-component epoxy impregnating resin solvent-free low-volatile storage stability,dielectric dissipation factor
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