摘要
在传统工艺流程中,必须先将干膜贴于工件表面,然后进行光刻,但干膜不可重复使用。现提出一种新型干膜光刻工艺流程,在干膜贴于工件表面之前,先对干膜单独进行光刻试验研究。基于该新型工艺流程,研究了杜邦干膜GPM220的曝光及显影特性。经过对曝光量(曝光时间)及显影时间的参数优化,最终在干膜上获得了平均直径为99.7μm的通孔阵列,并将其作为掩膜应用于微细电解加工,通过选择合理的加工参数,在工件表面获得了平均直径为125μm、平均深度为10μm的微坑阵列。电解实验后的干膜易与工件分离,可实现重复使用,提高了干膜的利用率。
In the traditional process,the dry-film is photoetched after it is sticked on the surface of the workpiece,but it can not be used repeatly. A new technological process of the dry-film is put forward,which the photoetching is proceeded with the dry-film before it pasting. Based on this process,the properties of exposure and development are studied. Optimizing the parameters,the micro throughhole array with diameter 99.7 μm is well generated in the dry-film,and it is successfully employed in the through-mask electrochemical micromachining. Selecting reasonable parameters,the micro-dimple array with diameter 125 μm and 10 μm deepth is well prepared on the workpiece. The dry-film is liable to separate from the workpiece and is used repeatly,thus its utilization is higher.
出处
《电加工与模具》
2014年第5期24-27,40,共5页
Electromachining & Mould
基金
广东联合基金重点项目(U1134003)
航空科学基金资助项目(2012ZE52068)
关键词
光致抗蚀剂(干膜)
曝光
显影
掩膜电解
dry-film photoresist
exprosure
development
through-mask electrochemical micromachining
