摘要
采用ABAQUS有限元模拟软件,建立氧化铝陶瓷-钨铜金属功率集成电路外壳的三维计算模型,对其钎焊封装的残余应力进行模拟计算,并系统地分析了外壳设计因素和钎焊因素对封装的残余应力分布及大小的影响。结果表明,氧化铝陶瓷-钨铜金属外壳封装的残余应力存在应力集中现象,主要集中在封接区域;瓷框和底座的厚度比、封接宽度、瓷框倒角半径及钎焊降温速率等因素对其应力分布和大小都有一定的影响。研究结果对外壳封装的可靠性评估和优化设计有一定的指导意义。
A 3Dcalculating model of power package of Al2O3ceramic-WCu metal is proposed to analyze the residual stress of packaging by using ABAQUS finite element program in this paper,and the factors of package design and seal which have effect on the distribution and magnitude of residual stress are studied systematically.The calculation results suggest that the residual stress of packaging has stress concentration on the sealing area.The thickness ratio of ceramic and metal base,sealing width,chamfered radius of ceramic and sealing temperature have certain influence on the distribution and magnitude of residual stress.The results are expected to act as database for improving reliability evaluation and optimizing design of packaging.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2014年第5期492-497,共6页
Research & Progress of SSE
关键词
封装
残余应力
有限元算法
应力集中
packaging
residual stress
finite element method
stress concentration
