摘要
采用H3 PO4，Al（ OH）3为主要原料合成金属基陶瓷涂层用无机胶粘剂，以磷酸盐胶粘剂为基料，添加氧化铜为固化剂，通过设计氧化铜和磷酸盐的配比即调胶比配制而成；并将其刷涂在金属基体表面。研究氧化铜粒度、调胶比、固化温度和时间对胶黏剂粘结强度的影响；利用电子万能试验机测试其拉伸、剪切强度。采用扫描电镜分析粘结机理。结果表明：随着磷酸盐密度增大，调胶比由小到大时，胶粘剂的粘接强度由大变小。随着固化时间的增加，胶粘剂的粘接强度增大；随着固化温度的升高，胶粘剂的粘接强度先增大后减小。胶粘剂Al／P＝1：3、氧化铜粉粒径为200～400目、调胶比为4g／ml、固化温度为160℃、固化时间不少于3h时，能达到理想的粘接强度。基体与胶粘剂的界面结合强度源于机械互锁与互扩散。
The metal matrix ceramic inorganic adhesive was prepared by the reaction of Al （ OH ） 3 and H3 PO4 .The based material phosphate adhesive and curing agent copper oxide were coated on the surface of met -al substrate with different tune -cement ratio .The effect of copper oxide particle size , tune-cement ratio , cu-ring temperature and time was studied .The tensile shear strength was tested by electronic universal testing ma-chine .The bond mechanism was analyzed by scanning electron microscopy .The results showed that with the in-crease of density of phosphate and glue ratio , the bonding strength of adhesive decreased , with the increase of curing time, the bonding strength of adhesive increased , and with the increase of curing temperature , the bond-ing strength of adhesive increased firstly and then decreased .The desired bond strength was achieved in condi-tion of adhesive Al/P=1：3, copper oxide particle size of 200~400 meshes, glue ratio of 4g/ml, curing temper-ature of 160℃, and the curing time of not less than 3h.The substrate and adhesive was combined due to me-chanical interlocking and mutual diffusion .
出处
《佳木斯大学学报（自然科学版）》
CAS
2014年第5期723-725,共3页
Journal of Jiamusi University：Natural Science Edition
基金
2007年佳木斯大学校级理工类面上项目(L2007-85)
关键词
无机胶粘剂
调胶比
剪切强度
固化
inorganic adhesive
glue ratio
shear strength
curing
