摘要
主要综述了高导热率低膨胀加成型硅橡胶及导热填料的研究进展。首先介绍了常见的导热填料及其基本性能,主要包括金属类、氧化物类、氮化物类、碳化物类等;详细描述了各类填料的性能特点,并指出了填料基本性能对导热系数的影响,主要包括填料的比例、尺寸、尺寸分布、形状及填料的表面性质等。其次详细介绍了提高导热系数的基本途径,主要包括导热机理介绍;基体材料研究;研发新型高性能导热填料;进行导热填料表面改性;对硅橡胶成型工艺进行优化等;然后介绍了降低热膨胀系数的一些基本途径,主要包括无机纳米粒子改性等。最后指出了目前该研究领域存在的一些基本问题及解决思路,并对未来的发展方向进行了展望。
Advances in the high thermal conductivity and low expansion rate silicone rubber and thermally conductive filler were summarized.First,the common thermally conductive filler and basic properties of thermally conductive filler were introduced,including metals,oxides,nitrides,carbides,etc..And the performance characteristics of various types of thermally conductive filler was described in detail and pointed out the influence of the basic performance of the thermal conductivity on thermal conductivity,including filler ratio,size,size distribution,shape and surface properties of the filler and so on.Followed by a detailed description of the basic ways to improve thermal conductivity were given,including introduction of thermal conductivity mechanism;matrix materials research;development of new high-performance thermally conductive filler;conduct thermally conductive filler surface modification;silicone rubber molding process optimization,etc..Then some basic ways to reduce the coefficient of thermal expansion were introduced,including modification of inorganic nanoparticles and so on.Finally,some of the basic problems acurrently existing in the field and some ideas of solutions were advanced and the development trends were prospected.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2014年第20期20001-20006,20011,共7页
Journal of Functional Materials
基金
国家自然科学基金资助项目(50903031)
中央高校基本科研业务费专项资金资助项目(2013ZM0072)
华南理工大学中央高校基本科研业务费学生科技创新资助项目(10561201462)
广东省重大科技专项计划资助项目(2010A080406002)
广州市国际科技交流与合作专项资助项目(2012J5100043)
广东省绿色化学产品技术重点实验室开放基金资助项目(GC201201)
关键词
高导热率
低膨胀
导热填料
复合型
硅橡胶
热界面材料
high thermal conductivity
low expansion
thermally conductive filler
composites
silicone rubber
TIM
