摘要
通过研究钼金属靶材轧制变形量及热处理工艺对溅射薄膜的微观组织、表面粗糙度及晶形的影响,结果表明:变形量为80%的钼靶材溅射制备的薄膜晶化程度优于变形量小的靶材溅射薄膜;溅射相同的薄膜厚度,随着靶材变形量的增大,溅射薄膜的方阻越大;1373K退火靶材溅射薄膜的粗糙度最小,表面颗粒最细小均匀,晶粒取向明显。
Rolling Mo plates with different microstructure at different rolling deformation rate and heat treatment were sputtered into Mo thin films under the same sputtering technology. The sheet resistance, microroughness and grain orientation were tested. The sputtering films with deformation ratio over 80% recrystallize better than that below 80%o. When the sputtering films＇ thickness is the same, the square resistance of Mo target with higher deformation ratio is higher than that of the less procession ratio. When the heating treatment temperature of Mo target reaches 1373 K, the sputtering film＇s roughness is the lowest, the grains＇ orientation is clear, the grain of sputtering film is quite fine and uniform.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2014年第22期102-105,113,共5页
Materials Reports
基金
国家科技支撑计划课题(2012BAE06B02)
关键词
钼
靶材
微观组织
溅射
Mo, target, microstructure, sputtering
