摘要
介绍了国内外采用化学法和物理法制备低热膨胀聚酰亚胺的研究进展,阐述了低热膨胀系数聚酰亚胺在挠性印制电路板、封装材料中的应用情况,并展望了其应用前景。
The research progress of polyimide with low thermal expansion coefficient, which was preparedfrom chemical method and physical method, was introduced, and the application of the polyimidewith low thermal expansion coefficient in flexible printed circuit board and packaging material were reviewed.The application prospect was proposed.
出处
《绝缘材料》
CAS
北大核心
2014年第6期10-12,共3页
Insulating Materials
关键词
聚酰亚胺
热膨胀系数
制备
应用
挠性印制电路板
封装材料
polyimide
thermal expansion coefficient, preparation
application
flexible printed circuitboard
packaging material
