摘要
对噪声振动环境下的仪器电路板损伤进行了研究,以解释高噪声环境下某机箱电路板引脚断裂机理。应用噪声激励下激光测振技术、声传递试验方法、有限元分析动态响应分析技术,给出了元器件管脚动态应力分布,并根据S-N曲线对结构的寿命进行评估分析,理论分析所得出的失效模式及寿命时间和试验情况基本吻合。本文所探索的噪声激励下的电路板应力分析及寿命评估技术可以用来评估力学环境造成的仪器损伤,拓展了仪器可靠性评估途径,具有较高的工程应用价值和借鉴意义。
This paper research the damage of the instrument in the noise environment, explain the problem that the pin of PCB fracture in the test of noise vibration with high level, The noise excitation and laser vibration technique, sound transfer examination, the modal test and finite element calculation have been analyzed, and worked out the distribution of dynamic stress of the pin. And in the paper, the result that the failure mode and life time getting form the assessment according to the S-N curve is coincided with test was got, which shows that the analysis method is effective, and affords theoretical support for the mechanism research of the fault phenomenon and its improvement,continuation the method of reliability research in instrument.
出处
《强度与环境》
2014年第5期51-55,共5页
Structure & Environment Engineering
关键词
电路板
噪声振动
引脚断裂
激光测振
疲劳损伤
PCB noise vibration thefractureof pin vibration determination with laser fatigue damage
