摘要
介绍了半导体圆片存在的各种污染杂质的类型和去除方法,并概要总结了半导体圆片的清洗技术,对半导体圆片的湿法和干法清洗特点和去除效果进行了比较分析。
This paper introduces the semiconductor wafer exist various pollution type of impurity andremoving methods, summary and summarized the semiconductor wafer cleaning technology, wetprocess and dry process of semiconductor wafer cleaning characteristics and removal efficiency areanalyzed in comparison.
出处
《电子工业专用设备》
2014年第7期18-21,共4页
Equipment for Electronic Products Manufacturing
关键词
污染杂质
半导体
湿法清洗
干法清洗
Pollution of impurities
Semiconductor
Wet cleaning
Dry cleaning
