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无铅焊锡膏的研究进展及应用现状 被引量:5

Research Development and Application of Lead-free Solder Paste
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摘要 随着人们环保意识的增强,焊锡膏的发展也迈入了另一个快速发展的阶段:有铅向无铅化的转变;含卤向低卤、无卤的转变。本文就高温、中温、低温体系选取了几种有代表性的锡膏,综述了Sn-Ag、Sn-Sb、Sn-Cu、Sn-Bi-Ag、Sn-Sn、Sn-Bi、Sn-In合金体系的研究进展及其应用,最后展望了焊锡膏的发展趋势。 Following the strengthen of environmental awareness, the development of solder paste has entered into another phase of rapid development: shifting from lead-bearing towards lead-free, from halogenated towards low-halogen and halogen-free. Several representative pastes from high-temperature, medium temperature and low temperature systems, were summarized. The development process and new study of solder alloy systems, such as Sn-Ag, Sn-Sb, Sn-Cu, Sn-Bi-Ag, Sn-Sn, Sn-Bi, Sn-In, were introduced. The development tendency of solder paste was prospected at last.
出处 《热加工工艺》 CSCD 北大核心 2014年第23期9-11,16,共4页 Hot Working Technology
基金 惠州市科技计划项目(2012B020004019) 博罗县产业技术研究与开发项目(2011B01008)
关键词 焊锡膏 高温 中温 低温 助焊剂 solder paste high temperature medium temperature low temperature flux
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