摘要
随着人们环保意识的增强,焊锡膏的发展也迈入了另一个快速发展的阶段:有铅向无铅化的转变;含卤向低卤、无卤的转变。本文就高温、中温、低温体系选取了几种有代表性的锡膏,综述了Sn-Ag、Sn-Sb、Sn-Cu、Sn-Bi-Ag、Sn-Sn、Sn-Bi、Sn-In合金体系的研究进展及其应用,最后展望了焊锡膏的发展趋势。
Following the strengthen of environmental awareness, the development of solder paste has entered into another phase of rapid development: shifting from lead-bearing towards lead-free, from halogenated towards low-halogen and halogen-free. Several representative pastes from high-temperature, medium temperature and low temperature systems, were summarized. The development process and new study of solder alloy systems, such as Sn-Ag, Sn-Sb, Sn-Cu, Sn-Bi-Ag, Sn-Sn, Sn-Bi, Sn-In, were introduced. The development tendency of solder paste was prospected at last.
出处
《热加工工艺》
CSCD
北大核心
2014年第23期9-11,16,共4页
Hot Working Technology
基金
惠州市科技计划项目(2012B020004019)
博罗县产业技术研究与开发项目(2011B01008)
关键词
焊锡膏
高温
中温
低温
助焊剂
solder paste
high temperature
medium temperature
low temperature
flux