摘要
表面组装技术的迅速发展和应用广泛,促进了高可靠性电子装联技术的发展与完善。而回流焊工艺是表面组装技术的关键技术之一,因此得到一条优化的回流焊接曲线进而得到高可靠性焊点在SMT技术中显得尤为重要。该文主要分析了传送带速度、PCB板、焊膏等影响产品可靠性的主要因素,在此基础上总结出了回流曲线的设计原则,并根据实验确定了满足高可靠性焊点质量的回流焊温度曲线。
The rapid development and wide application of SMT promote high reliability electronics assembly technology＆#39;s development and improvement.And reflow process is one of the key technologies of SMT.So it is particularly important to get an optimized reflow profile and then get the solder joints of high reliability in SMT.This thesis analyzes the conveyor speed,PCB,solder paste and other major factors affecting the reliabil-ity of products and sums up the reflow profile design principles.Final y,according to the experiment we gain the reflow profile which meet the high reliability of Solder joints.
出处
《电子质量》
2015年第1期76-77,82,共3页
Electronics Quality
基金
北华航天工业学院青年基金项目(KY-2014-04)
廊坊市科学技术研究与发展计划项目(2014011057)
关键词
回流焊
回流曲线
高可靠性焊点
SMT
reflow
SMT
reflow profile
high reliability Solder joints
