摘要
超声波清洗技术是半导体材料制备的主要清洗方法,极大地提高了半导体材料制备的工作效率和清洗效果。阐述了超声波清洗作用原理。通过调节超声机功率密度、频率,进行晶片去蜡清洗实验,验证、分析了超声清洗过程中超声机功率密度、频率对晶片去蜡清洗的影响。
As a main cleaning technique for the preparation of semiconductor materials,ultrasonic cleaning technol-ogy has greatly improved the work efficiency of semiconductor material preparation and their cleaning effect. This paper introduced the principle of ultrasonic cleaning and through the adjustment of ultrasound machine’s power den-sity and frequency and the chip design for a dewaxing cleaning experiment,the effects of power density and fre-quency on wafer dewaxing were verified and analyzed.
出处
《天津科技》
2014年第11期3-4,共2页
Tianjin Science & Technology
关键词
超声波
去蜡
功率密度
频率
ultrasonic wave
dewaxing
power density
frequency
