摘要
研制一种新型硅片边缘超声振动抛光装置,利用抛光振子超声振动所产生的能量对硅片边缘倒角斜面进行抛光加工,以达到提高硅片边缘表面质量的目的。抛光振子的工作面与硅片一侧的整个倒角斜面完全接触,并且能够实现不同工艺条件下的抛光实验。实验装置由抛光振子、振子的固定装夹装置、硅片的定位安装装置以及抛光压力和抛光液供给系统组成。抛光振子由超声电机的振子改造而成,根据硅片尺寸及硅片边缘倒角斜面的角度确定抛光振子工作面的角度,利用ANSYS软件对振子进行有限元分析,并对加工后振子进行了实际测试。该实验装置能够实现硅片与抛光振子之间无宏观相对转动的实验,又能对抛光时间、抛光转速、抛光压力,抛光液流量等工艺参数进行控制,进而研究不同参数对抛光实验的影响。
A new apparatus of ultrasonic vibration polishing far wafer edge was developed, using ultrasonic vibration energy produced by polishing vibrator to polish silicon wafer edge bevel in order to reach the purpose of improving the quality of wafer edge surface. The working face of palishing vibrator is in contact with one side of wafer edge bevel completely and it can realize different polishing experiments under different process conditions. The experimental apparatus includes polishing vibrator and it＇s fixture, positioning device of silicon wafer, polishing pressure and palishing fluid supply system. Polishing vibrator is reformed from the vibrator of ultrasonic motor. According to the size af silicon wafer and it＇s angle of edge bevel, the shape of the working face about polishing vibrator is determined. FEM analysis is carried out by ANSYS software before the vibrator being machined, and then tests it. The experimental apparatus can conduct experiments without macro relative rotation between wafer and polishing vibrator and be able to control process parameters such as polishing time, polishing speed, polishing pressure and polishing fluid, and then it＇s convenient to study on the effect of different parameters on the polishing experiments.
出处
《机械设计与制造》
北大核心
2015年第2期126-128,共3页
Machinery Design & Manufacture
基金
国家自然基金资助(51075195)
关键词
硅片边缘
超声振动
行波
抛光振子
化学机械抛光
Wafer Edge
Ultrasonic Vibration
Traveling Wave
Polishing Vibrator
Chemical Mechanical Polishing
