摘要
目的研究无溶剂复合过程中热封膜摩擦因数的变化。方法从不同热封层薄膜厚度、不同热封层配方结构及熟化控制等3方面研究无溶剂复合摩擦因数的变化规律。结果无溶剂复合用热封膜的厚度越厚,摩擦因数的变化越小。在实际生产中膜厚必须在35μm以上,摩擦因数的变化才容易控制。采用抗迁移性能好的热封膜可以减缓摩擦因数的上升,在生产过程中温度的变化对摩擦因数的变化影响很大。结论改善无溶剂复合摩擦因数可以从改进爽滑剂配方、热封膜结构及无溶剂复合工艺等方面着手,使无溶剂复合产品的摩擦因数控制在0.25以下。
The aim of this study was to investigate the variation of the friction coefficient of heat sealable film during the solvent-free compounding process. The variation rule of the friction coefficient was studied from three aspects,including the film thickness of the heat sealable layer, the formula of the heat sealable film, and curing process control. The thicker the heat sealable film used for solvent-free compounding, the smaller the variation of the friction coefficient. In practical production, the thickness of the heat sealable film must be above 35 μm, in order to control the variation of the friction coefficient. Application of heat sealable film with good anti-migration properties could slow down the increase of the friction coefficient, and the temperature change during the production had great influence on the variation of the friction coefficient. In order to improve the friction coefficient of solvent-free compounding, the slipping agent formula, the structure of heat sealable film, and the solvent-free compounding technology should be improved to control the friction coefficient of the solvent-free composite product below 0.25.
出处
《包装工程》
CAS
CSCD
北大核心
2015年第5期56-58,116,共4页
Packaging Engineering
关键词
无溶剂复合
摩擦因数
异氰酸酯基
爽滑剂
solvent-free compounding
friction coefficient
NCO
slipping agent
