摘要
介绍了钨合金电镀的发展历程。说明了铁镍钨、酸性镍钨磷、镍钨和碱性镍钨磷这几种电镀工艺的典型配方及应用。按工艺步骤论述了一些常见故障并提出了处理措施。指出目前的主要问题是放大后规模化生产控制。展望了钨合金工艺发展前景。
The development history of tungsten alloy plating was introduced. The typical formulations of iron-nickel-tungsten, acidic nickel-tungsten-phosphorus, nickel-tungsten, and alkaline nickel-tungsten-phosphorus alloys plating and their applications were described. Some common faults were discussed according to the process procedure, and the corresponding countermeasures were given. It is pointed out that the main problem nowadays is the control of large-scale production after magnification. The development prospect of tungsten alloy plating technology was presented.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2015年第3期153-157,共5页
Electroplating & Finishing
关键词
钨合金
电镀
配方
工艺
tungsten alloy
electroplating
formulation
process
