摘要
特氟龙电路板在印制电子行业中应用越来越广泛。其加工前期工序——钻孔工序质量不易受控制。技术人员开发出适合于特氟龙电路板钻孔的PCB微钻和钻孔参数。本文选取Arlon公司的PTFE板块为研究对象,通过正交试验方法,对其PCB微钻和钻孔参数进行了数据处理和研究,从而得出最优的参数组合,有效地解决了PTFE板材在钻孔过程中产生的孔壁粗糙、铜瘤等不良问题。
The polytetrafluoroethylene （PTFE） circuit board is widely used in the printed electronic industry. The quality of the drilling process is not easy to be controlled during the previous process of the PTFE. The technical staffs have to develop new PCB micro - drill and drilling parameters for the PTFE. In this paper, a kind of PTFE provided by Arlon company, which is in great demand in electronic circuit industry, and selected as the research object by the method of or- thogonal experiments. The PCB micro - drill and drilling parameters are analyzed and investigated so as to get the best pa- rameter＇ s combination which can effectively solve the problems of the rough of hole - wall and copper tumor during the process of drilling.
出处
《工具技术》
北大核心
2015年第2期41-44,共4页
Tool Engineering
基金
广州市番禺区珠江科技新星专项(2013-专15-6.03)
关键词
微钻
PTFE板材
印制电路板
硬质合金
micro -drill
PTFE board
printed circuit board
cemented carbide
