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新型聚苯醚改性环氧树脂 被引量:5

Epoxy resin modified by novel polyphenylene ether
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摘要 采用二苯醚单体合成的含有羟基的新型改性聚苯醚(modified polyphenylene ether,MPPE)可直接作为环氧树脂的固化剂和改性剂.运用傅里叶变换红外光谱对聚苯醚结构进行了表征,对MPPE/E51体系的性能进行了研究.结果表明:随着E51含量的增加,体系的固化温度降低;随着MPPE含量的增加,体系的热分解温度(Td5%)明显升高;当MPPE含量为E51的2倍时,MPPE/E51层压板具有较低的介电常数(3.51,1 GHz)、介电损耗(0.008 9,1 GHz)和吸水率;MPPE/E51层压板体系具有较高的冲击强度,最高可达63.34 k J/m2. As a curing agent and modified agent of epoxy resin, modified polyphenylene ether (MPPE) containing hydroxyl group was synthesized, and characterized by Fourier transform infrared spectroscopy (FTIR). The properties of MPPE/E51 were investigated, and the following results were obtained. The curing temperature is gradually decreased with the increase of content of E51. Thermal stability of the epoxy resin thermosets is improved with the maximum TG5% being 385℃. The laminated sheet of MPPE/E51 has low dielectric constant (3.51, 1 GHz), dielectric loss (0.0089, 1 GHz) and low water absorption. Impact strength of MPPE/E51 is up to 63.34 kJ/m2.
出处 《上海大学学报(自然科学版)》 CAS CSCD 北大核心 2015年第1期38-45,共8页 Journal of Shanghai University:Natural Science Edition
基金 国家自然科学基金资助项目(51003030)
关键词 聚苯醚 环氧树脂 介电性能 polyphenylene ether (PPE) epoxy resin dielectric property
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  • 1Kim W, Bae J W, Cho I D, et a1. Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation [J]. Polymer Engineering and Science, 1999, 39(4): 756-766.
  • 2Lin C H, Huang J M, Wang C S. Synthesis, characterization and properties of tetramethyl stilbene-based epoxy resins for electronic encapsulation [J]. Polymer, 2002, 43(10): 2959-2967.
  • 3张续柱,王严杰.改性环氧覆铜板高电性能的研究[J].纤维复合材料,2002,19(1):33-34. 被引量:7
  • 4Singha S, Thomas M J. Dielectric properties of epoxy nanocomposites [J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2008, 15(1): 12-23.
  • 5孟季茹,梁国正,何洋,赵磊,朱光明.聚苯醚改性环氧树脂基覆铜板的研制[J].复合材料学报,2003,20(1):74-78. 被引量:18
  • 6李爱英,常杰云.聚苯醚改性的研究进展与应用[J].工程塑料应用,2011,39(2):96-99. 被引量:31
  • 7Yoshiyuki I, Anthony J R. Processing of poly(2,6-dimethyl-1,4-phenylene ether) with epoxy resin. 1. reaction-induced phase separation [J]. Macromolecules, 2000, 33(1): 158-166.
  • 8万勇军.覆铜板用热固性聚苯醚[J].热固性树脂,2001,16(4):25-28. 被引量:13
  • 9Nunoshige J, Akahoshi H, Shibasaki Y. et a1. Efficient oxidative coupling polymerization for synthesis of thermosetting poly (phenylene ether) copolymer with a low dielectric loss [J]. Journal of Polymer Science Part A: Polymer Chemistry, 2008, 46(15): 5278-5282.
  • 10Fukuhara T, Shibasaki Y, Ando S, et a1. Synthesis of thermosetting poly (phenylene ether) containing allyl groups [J]. Polymer, 2004, 45(3): 843-847.

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