摘要
采用有铅焊膏焊接无铅BGA是当前高可靠电子产品组装中应对BGA器件无铅化的手段之一。混合焊接时焊接温度曲线是影响BGA焊接质量和焊点性能的关键因素。研究不同焊接温度曲线条件下无铅BGA的塌落高度和焊点中空洞状况。研究结果表明,采用有铅焊膏焊接Sn Ag Cu BGA,但焊接峰值温度为215℃和220℃时,BGA未完全塌落,继续提高峰值温度到225℃,BGA塌落高度与有铅焊膏焊接有铅BGA的塌落高度接近;继续升高峰值温度,无铅BGA的塌落高度变化不大。当焊接峰值温度从215℃提高到230℃,混装焊点中的空洞逐渐减少;焊接峰值温度继续提高,焊点中空洞反而增加。
Soldering lead-free BGA with tin-lead solders is inevitable in high reliability electronics assembly because more and more BGA solder balls have changed from tin-lead to lead-free. Soldering temperature plays an important role in deciding the quality and performance of solders. Effect of reflow peak temperature on collapse and voids in mixed solders is investigate. Results indicated the amount of collapse of SnAgCu BGA solder balls soldered at peak temperature of 225 ℃ was similar to that of SnPb BGA soldered with SnPb paste at peak temperature of 215 ℃. With the increase of peak temperature from 225 ℃ to 235 ℃, the amount of collapse had little change. When reflow peak temperature increase from 215 ℃ to 230 ℃, voids in mixed solders decreased gradually. While voids increased when peak temperature continue increased to 235 ℃.
出处
《电子工艺技术》
2015年第2期73-75,121,共4页
Electronics Process Technology
基金
总装预研项目(1151318150200)
