期刊文献+

继电器类电子产品安装灌封工艺技术研究 被引量:1

Study on Encapsulation Technology of Electronic Products Relay Installation
下载PDF
导出
摘要 继电器类电子产品由于振动造成的产品故障尤为突显。为提高继电气类电子产品在环境试验中的可靠性,尤其是抗振动能力,对继电器安装工艺进行了研究。通过对灌封材料性能参数及灌封工艺试验结果对比,从中选取3种灌封胶对产品进行灌封工艺方法研究。各种环境试验结果表明,灌封是提高产品可靠性的一种有效手段,三种灌封胶均可提高产品抗振动能力。最后,通过比较灌封后继电器在大量级振动下的响应,得出更有效的灌封材料。 The relays product failure caused by the vibration is particularly prominent. To improve electronic product with relays in the reliability of environmental testing, especially the ability to resist vibration, research the relay installation process in use of PCB encapsulation process. By comparing the material parameter and test result, selected three kinds of encapsulation materials for process study. The environmental test proved that the encapsulation process on this product is a kind of effective means to enhance the reliability of products. Three materials can improve product vibration resistance. In the end, by comparing the response of the encapsulated relays under height level vibration test, get more effective encapsulation material.
出处 《电子工艺技术》 2015年第2期110-114,共5页 Electronics Process Technology
关键词 电子产品 灌封 继电器 可靠性 Electronic product Encapsulation Relay Reliability
  • 相关文献

参考文献5

二级参考文献16

共引文献67

同被引文献5

引证文献1

二级引证文献4

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部