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Microstructure and formation mechanism of SHS joining between C_f/Al composites and TiAl intermetallic with Al–Ni–CuO interlayer 被引量:4

Microstructure and formation mechanism of SHS joining between C_f/Al composites and TiAl intermetallic with Al–Ni–CuO interlayer
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摘要 In this study, it was reported a novel approach for joining Cf/A1 composites and TiA1 intermetallic by self- propagating high-temperature synthesis (SHS). Mixed powders of 14A1-2Ni-3CuO were used as the SHS inter- layer, and differential thermal analysis test of A1-Ni-CuO interlayer was conducted to analyze the exothermic char- acteristic. Sound joint was got by SHS joining under the conditions of 600 ℃, 30 min, and 5 MPa. The joint was characterized by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and X-ray diffrac- tion (XRD). TiA13 and NiA13 are, respectively, formed in the TiA1/interlayer and Cf/A1/interlayer interfaces. Reac- tion products of Ni2Al3, NiAl3, A1203, and Cu were observed in the interlayer. And the formation mechanism of SHS joining was investigated. In this study, it was reported a novel approach for joining Cf/A1 composites and TiA1 intermetallic by self- propagating high-temperature synthesis (SHS). Mixed powders of 14A1-2Ni-3CuO were used as the SHS inter- layer, and differential thermal analysis test of A1-Ni-CuO interlayer was conducted to analyze the exothermic char- acteristic. Sound joint was got by SHS joining under the conditions of 600 ℃, 30 min, and 5 MPa. The joint was characterized by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and X-ray diffrac- tion (XRD). TiA13 and NiA13 are, respectively, formed in the TiA1/interlayer and Cf/A1/interlayer interfaces. Reac- tion products of Ni2Al3, NiAl3, A1203, and Cu were observed in the interlayer. And the formation mechanism of SHS joining was investigated.
出处 《Rare Metals》 SCIE EI CAS CSCD 2015年第1期17-21,共5页 稀有金属(英文版)
基金 financially supported by the National Natural Science Foundation of China (No. 51075101)
关键词 SHS Joining MICROSTRUCTURE Formationmechanism A1-Ni-CuO interlayer SHS Joining Microstructure Formationmechanism A1-Ni-CuO interlayer
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