摘要
针对某型CCD图像传感器划片过程中产生的静电损伤、崩边等缺陷造成器件失效,通过优化划片工艺条件,避免了静电损伤,减少了崩边缺陷,封装的成品率由48%提高至96%。
ESD damage and chipping in the dicing process will result in the failure of CCD image sensors. Based on which, by the optimization of the dicing process, the ESD damage and die chipping were effectively decreased, and then the yield rate of package is improved from 48% to 96%.
出处
《半导体光电》
CAS
北大核心
2015年第1期85-87,共3页
Semiconductor Optoelectronics
