摘要
以工业副产脱硫建筑石膏为主要原料,有机硅防水剂为添加剂,采用化学发泡和掺入EPS颗粒两种不同的工艺制备轻质石膏制品,研究了其对干密度和吸水率的影响。结果表明,随水膏比及发泡剂用量的增加,发泡石膏制品干密度降低,吸水率升高,最佳水膏比为0.55,发泡剂掺量在16%;加入适量甲基硅酸钠不但可改善发泡石膏制品的耐水性,还可催化发泡剂降低石膏制品干密度,改善石膏制品孔结构,其最佳掺量在4%;聚苯乙烯(EPS)颗粒的适量掺入能有效降低石膏制品干密度和吸水率。EPS颗粒掺量为3.5%时,石膏制品干密度比未掺EPS颗粒降低65%,比化学发泡法制得的石膏降低32%。EPS颗粒掺量为2.5%时,其吸水率仅达到4.3%,比化学发泡法制得的石膏降低85%。
This paper takes the industrial by-product desulfurization gypsum as main raw materials, with organosilicon waterproofing agent as additives, using chemical foaming and the incorporation of EPS particles of two different preparation processes, to prepare lightweight gypsum products, and studied the effects of the parameters to the dry density and the water absorption rate of the products.Results show that, with the increase of water gypsum ratio and the foaming agent dosage, the dry density of the foaming gypsum products decreases, while the water absorption rate increases. The best water gypsum ratio is about 0.55, and the best foaming agent content is about 16%. Addition of proper amount of sodium methyl silicate can not only improve the water resistance of the foaming gypsum products, but also catalyze the foaming agent to reduce the dry density, and improve the pore structure of the foaming gypsum products. The best mixing amount of sodium methyl silicate is about 4%. The doping of EPS particles can effectively reduce the dry density and the water absorption rate of the gypsum products. When the EPS particle content is 3.5% of gypsum, the dry density of gypsum products is reduced by more 65% than that without EPS particles, and the dry density is reduced by more 32% than that prepared by chemical foaming process. When the EPS particle content is 2.5%, the water absorption rate of the gypsum products is 4.3%, which is 85% less than that prepared by chemical foaming process.
出处
《非金属矿》
CAS
CSCD
北大核心
2015年第3期34-36,共3页
Non-Metallic Mines
基金
新疆兵团重点领域科技攻关项目(2014BA017)
新疆兵团科技支疆计划项目(2014AB027)
关键词
脱硫建筑石膏
轻质制品
耐水
化学发泡
EPS颗粒
desulfurization building gypsum
light material
water resistant
chemical foaming
EPS particles
