摘要
分别以马尾松松香、湿地松松香和思茅松松香为主要活性成分配制液体助焊剂,采用扩展率试验法研究3种脂松香对Sn0.7Cu焊料在铜基板上润湿性能的影响,测试了助焊剂的物理性能,并分析了扩展率≥75%时的焊点形貌。结果表明：在含量为5%~55%时,随着含量的递增,马尾松松香、湿地松松香及思茅松松香对Sn0.7Cu焊料的扩展率均呈逐渐递增的趋势,并且在相同含量条件下,马尾松松香和思茅松松香的扩展率高于湿地松松香;当含量≥25%时3种松香的扩展率均高于70%,达到SJ/T 11389—2009中L级无卤素松香基助焊剂要求,并且各松香助焊剂物理稳定性和干燥度合格,铜板腐蚀性较低,焊后表面绝缘电阻不低于1.0×108Ω;当马尾松松香和思茅松松香在含量为45%~55%、湿地松松香在含量为55%时扩展率≥75%,达到SJ/T11389—2009中M级无卤素松香基助焊剂要求,其中马尾松松香扩展率高于湿地松松香,并且焊点饱满,表面光亮,成形性优于思茅松松香,因此更适合用作Sn0.7Cu焊料用中等活性助焊剂。
The welding performance of masson pine rosin,slash pine rosin and Simao pine rosin to Sn0.7Cu lead-free solder were tested conform to the electronic area standard SJ/T 11389-2009 with content of 5% ~ 55%,including spreading ratio,physical performance and macroscopically appearance of welding spot.The results showed that spreading ratio of Sn0.7Cu solder on the cooper plate were increasing gradually along with the increase of rosins＇ content,and masson pine rosin and Simao pine rosin showed better help wetting ability than slash pine rosin at the same contents.All the spreading ratios were higher than 70%when the rosins content were no less than 25%,which matched the request of L level halogen-free rosin based flux of SJ/T 11389-2009,and the physical stability,dryness,copper plate corrosion texts and surface insulation resistance（SIR） of these rosins based fluxes were all meeting the standard above in that condition.When the content of masson pine rosin or Simao pine rosin was between 45% to 55%,slash pine rosin was 55%,the spreading ratios were higher than 75%that matched the request of M level halogen-free rosin based flux of SJ/T 11389-2009,and the masson pine rosin showed better appearance of welding spot than Simao pine rosin,thus it was more suitable for Sn0.7Cu as the M level flux.
出处
《化学研究与应用》
CAS
CSCD
北大核心
2015年第6期934-939,共6页
Chemical Research and Application
基金
国家林业局公益性行业科研专项(201304602)资助
