摘要
提出了一种在银浆料LTCC基板表面银导体上采用化学镀镍钯金工艺制造LTCC微波多层基板的新方法。不同体系的生料、浆料试验表明选择合适的生料和浆料配套材料,可实现银浆料LTCC镀金基板的可靠性制造。通过镀层可键合性能优化镀层厚度参数,测试了银浆料LTCC镀金基板镀层可键合性、可焊性、耐焊性、膜层可靠性、基板可靠性、基板环境适应性及电性能,各项性能均能满足微波组件的工程应用要求,其膜层可靠性甚至优于全金导体LTCC基板,为LTCC微波多层基板的低成本生产提供了一条有效的技术途径。
A new method of ENEPEG surface treatment is presented which is used for production of microwave LTCC substrate with silver conductor .Experiments on different green tapes and silver pastes show that ENEPEG surface treatment is feasible and reliable for special green tape and silver paste .The depth of every layer of ENEPEG is optimized with gold wire bonding force .The research shows that ENEPEG surface on sil-ver conductor LTCC substrate has good wire bonding ability , solderability and solderelaching resistance; the metal film reliability is even better than gold paste LTCC substrate;the substrate′s reliability , adaptability for worse environment and electric performances are compatible with microwave module production engineering ap -plication .The new method provides an effective alternate route for low cost production of microwave LTCC substrate .
出处
《电子机械工程》
2015年第3期45-49,共5页
Electro-Mechanical Engineering
关键词
LTCC
银浆料
镀金
LTCC
silver paste
gold-plating
