摘要
半导体硅片退火工艺对生产硅片具有十分重要的作用,为此,本文加强对硅片的退火技术检测,希望能够控制硅片技术质量。因为自然界当中并不存在单体硅,硅主要以氧化物或者是硅酸盐的形式出现,需要通过提纯与精炼的方式才能够形成硅片。这个过程中硅需要进行退火工艺处理,消除硅片中氧施主的影响,内部缺陷也在这个过程中减少。这个工艺流程是制造半导体硅片的重要环节。退火后的技术检测则是实现硅片生产的最后一个环节,是确保硅片质量的重要基础。本文侧重对半导体硅片退火检测工艺发展情况进行具体阐述。
Semiconductor wafers annealing process for the production of silicon plays an important role, therefore,to strengthen the annealing technology of silicon wafer testing,this paper hopes to be able to control quality of silicon technology.Because of nature does not exist monomer silicon,silicon mainly take the form of oxide or silicate,need silicon wafers are formed by means of purification and refining.The silicon needs to be in the process of annealing process,the surface to remove impurities,defects in the process also reduce.This process is an important link in manufacturing semiconductor wafers.After annealing technology test is the last link in silicon production,is the important foundation to ensure the quality of silicon wafers.This article focus on semiconductor wafers annealing detection technology development.
出处
《电子测试》
2015年第7期83-84,共2页
Electronic Test
关键词
半导体
硅片
退火
检测工艺
semiconductor
The wafer
Detection
technology
