摘要
阻焊油墨的固化程度是影响其阻焊性能及后续工序制作的重要因素,本文主要采用显微红外光谱法,只需更少的样品量,按照相应基团特征峰的变化情况,推断计算公式,建立方便快捷的阻焊油墨固化率测定方法。
The curing rate of solder resist ink is the key factor. A new quick and convenient method for quantitative analysis of the curing rate will be introduced in the paper. The method will use the FT-IR microscope and give the answer according to the changes of the corresponding group characteristic peak with fewer samples.
出处
《印制电路信息》
2015年第1期34-36,共3页
Printed Circuit Information
关键词
阻焊油墨
固化率
红外显微镜
Solder Resist Ink
Curing Rate
FTIR Microscope
