摘要
锡铋合金是一种比较理想的低温无铅焊料,但是铋的氧化会使焊料润湿性变差,严重阻碍其应用。活化剂能除去焊料表面氧化物,提高焊料的润湿性。以锡铋焊料的铺展性能和焊点形貌作为评价的主要指标,通过焊接实验研究活化剂用量、活化剂配比对锡铋焊料助焊剂的物理性能及锡铋焊料铺展性能的影响。结果表明:活化剂质量分数为25%,活化剂柠檬酸、水杨酸、丁二酸的质量之比为2∶3∶4时,助焊剂不挥发物含量低于5%,稳定性好,不粘性合格;且得到的焊膏焊点外观规则,光亮饱满,焊接头光滑,焊料铺展率达到79.6%。
Tin bismuth alloy is an ideal low-temperature lead-free solder, but the oxidation of bismuth will deteriorate the wettability of solder and seriously hinder the application of the Tin bismuth alloy. Tile activator can remove the oxide on the solder surface and improve the wettability of solder. The spreadability of tin bismuth solder and the appearance of welding spot are considered as the ,nain indexes, the effect of different amount and matching of activator on the physical properties of soldering flux and spreadability of tin bismuth solder is studied by welding test. The results show that when the mass fraction of activator is 25% and mass ratio of citric acid, salicylic acid and succinic acid as activator is 2：3：4, the non-volatile matter content of soldering flux is less than 5%, and soldering flux has good stability and qualified non-viscidity. The appearance of welding spot of solder paste is regular, beamy and full, and welded joints are smooth, and the spreadability of solder can reach 79.6%.
出处
《电焊机》
2015年第7期23-27,共5页
Electric Welding Machine
基金
云南省应用基础研究项目(2013FZ123)
红河学院大学生创新性训练实验项目
关键词
免清洗
活化剂
铺展率
no-clean
activator
spreadability
