摘要
A frequency-multiplied source at the terahertz band using discrete planar Schottky diodes, which is a critical element in heterodyne instruments, has been studied by some domestic research institutions in recent years. Besides the design method, there are still many crucial problems that must be taken into consideration in the design. This article mainly discuss three aspects based on the measured data of a 225 GHz tripler that we designed. Firstly, the accuracy of the diode model concerns the reliability of the simulation results. According to the Spice parameters and the measured results, the physical size and the DC parameter of the Schottky diode can be corrected until there is a good consistency between the simulated and measured results. Secondly, the heat accumulation happens to the Schottky junction when the high input power is added. A steady-state thermal simulation is done and the results show that the hottest temperature is about 140℃ with 250 mW input power, which is safe to the diode. Lastly, some non-ideal factors are brought during the assembly process such as the uncertainty in the conductive adhesive shape and location deviation of the circuit. Furthermore, the effect on the performance of the frequency multiplier is calculated in this work.
A frequency-multiplied source at the terahertz band using discrete planar Schottky diodes, which is a critical element in heterodyne instruments, has been studied by some domestic research institutions in recent years. Besides the design method, there are still many crucial problems that must be taken into consideration in the design. This article mainly discuss three aspects based on the measured data of a 225 GHz tripler that we designed. Firstly, the accuracy of the diode model concerns the reliability of the simulation results. According to the Spice parameters and the measured results, the physical size and the DC parameter of the Schottky diode can be corrected until there is a good consistency between the simulated and measured results. Secondly, the heat accumulation happens to the Schottky junction when the high input power is added. A steady-state thermal simulation is done and the results show that the hottest temperature is about 140℃ with 250 mW input power, which is safe to the diode. Lastly, some non-ideal factors are brought during the assembly process such as the uncertainty in the conductive adhesive shape and location deviation of the circuit. Furthermore, the effect on the performance of the frequency multiplier is calculated in this work.
