摘要
提出了一种不需要修改PCB元器件布局与约束方式,仅通过修改PCB安装结构实现降低PCB上元器件随机振动响应的方法。对PCB与其安装结构的组合进行模态仿真与随机振动仿真,分析PCB上元器件振动响应较大的原因,并针对性地进行了安装结构的改进设计。仿真结果表明,PCB安装结构的改进设计可以大幅降低板上电子元器件的振动响应。
To depress component random vibration response on PCB,a method of improving the PCB installation structure is proposed without changing components layouts on PCB or boundary conditions of PCB.By modal analysis and random vibration analysis of the assembly of the PCB and its installation structure,the reason of high component vibration response on PCB is obtained.The installation structure design is improved.Simulation result shows that the improvement of the installation structure design depresses the component vibration response on PCB significantly.
出处
《制导与引信》
2015年第1期46-50,共5页
Guidance & Fuze
关键词
安装结构
电子元器件
随机振动
installation structure
electronic component
random vibration
