摘要
综述了陶瓷劈刀的研究与应用进展,主要包括陶瓷劈刀的成分、结构、工作过程、质量缺陷、应用领域,特别是在微电子领域中的应用,重点评述了当前陶瓷劈刀在制造新工艺和运用方面存在的主要问题,指出寻找制造陶瓷劈刀的新材料和改进陶瓷劈刀的成型工艺是目前陶瓷劈刀的研究重点,并提出了陶瓷劈刀今后的发展方向。
The research progress on bonding capillary is summarized, including its composition, structure, working process, quality defects, and application field especially in microelectronics. The existing problem of new manufacturing process and application of bonding capillary is discussed significantly. Based on the suggestion that finding new material and improving molding process shall be the research focuses, the future development trends for bonding capillary are finally depicted.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2015年第17期89-94,105,共7页
Materials Reports
基金
国家自然科学基金(51272149
51402179)
关键词
陶瓷劈刀
引线键合
微电子封装
烧结
bonding capillary, wire bonding, microelectronics packaging, sintering
