摘要
目的研究标准冲击载荷下印制电路板的挠度响应以及各参数对电路板脆值的影响。方法考虑印制电路板在三角脉冲下的跌落冲击,将四边点支的电路板简化成梁的模型。将脉冲激励考虑为内在的位移,建立模型求解电路板的挠度和加速度响应,进而与电路板的本身特性比较,来考虑电路板的可靠性。结果当受到三角脉冲跌落冲击时,板的最大挠度变形和最大加速度都发生在板的中间位置附近,并且发生在中间时刻。结论为电路板在三角形脉冲下跌落冲击提供其可靠性的理论依据。
The aim of this work was to study the deflection response of printed circuit board under the standard impact load and the influence of different parameters on the brittle value of the circuit board. Considering the drop impact of the printed circuit board under the triangular pulse, the circuit board with four edges was simplified into a beam model. The impulse excitation was considered as the intrinsic displacement, and a model was built to solve the deflection and acceleration response of the circuit board, which were then compared with the features of the circuit board to evaluate the reliability of the circuit board. The maximum deflection and maximum acceleration of the plate both occurred near the middle of the plate, and in the middle of the moment when the plate was impacted by the triangular pulse. In conclusion, the theoretical basis for the reliability of the circuit board under the triangular pulse was provided.
出处
《包装工程》
CAS
CSCD
北大核心
2015年第17期84-86,99,共4页
Packaging Engineering
关键词
电路板
跌落冲击
三角形脉冲
可靠性
printed circuit board
drop impact
triangular pulse
reliability
