摘要
随着电子器件集成化、小型化的发展,电子设备封装密度增大、体积缩小,热流密度急剧增加,对冷却技术提出了更高的要求。微通道液冷系统能够大幅度提升设备冷却能力,满足电子设备日益增长的冷却需求。目前微通道加工的主流方法是高速铣削,然而微通道具有肋片宽度窄、通道直径小、通道高宽比大的特点,切削加工效率低下,且容易造成刀具折断。针对以上问题,分别选择0.2mm、0.3mm、0.4 mm和0.5 mm宽的微小槽道进行加工实验,并在不同切削参数组合下进行微通道铣削。通过切削实验和可行的微通道加工尺寸方案和刀具不折断条件下的合理切削参数,提高了微通道加工效率。
With the development of integration and miniaturization of electronic devices, the electronic equipment packaging density increases and its volume is reduced, which leads to a sharp increase in heat flux. This has put forward higher requirements on cooling technology. Micro channel liquid cooling system can greatly enhance the cooling capacity of electronic equipment to meet the growing cooling needs. Currently, the most commonly used method to process micro channel is high - speed milling. Due to the narrow fins, small channel diameter and high aspect ratio of micro channel, the cutting inefficiency is low and the cutting tool is easily to break during the cutting process. To solve these problems, micro channels with the width of 0.2 mm, 0. 3 mm, 0.4 mm and 0. 5 mm are selected for cutting experi- ment, and the micro channels are milled with different combinations of cutting parameters. From cutting experiments, the feasible machining dimensions which improve the processing efficiency of micro of micro channel and the reasonable cutting parameters channels without tool breakage are obtained.
出处
《制造技术与机床》
北大核心
2015年第10期115-118,共4页
Manufacturing Technology & Machine Tool
基金
陕西省科学技术研究发展计划项目(2015KJXX-67)
关键词
微通道
铣削
加工尺寸
切削参数
micro channel
milling
machining size
cutting parameters
