期刊文献+

La对Sn-0.3Ag-0.7Cu回流焊点纳米力学性能影响 被引量:5

Effect of La on nano mechanical properties of Sn-0.3Ag-0.7Cu reflow solder joints
下载PDF
导出
摘要 随着电子产业的不断发展,对微连接焊点可靠性的要求越来越高.文中在Sn-0.3Ag-0.7Cu的基础上添加第四种微量元素La,并制备出多种不同铼含量的焊球,通过回流焊得到Sn-0.3Ag-0.7Cu-x La焊点.采用纳米压痕仪对焊点进行一次加载—卸载试验,对试验所得到的载荷—位移数据通过采用Ma物理反解析法可得出焊点的纳米压痕硬度H、弹性模量E及蠕变速率敏感指数m等焊点的性能参数.研究稀土元素La对焊点纳米力学性能的影响.结果表明,随着微量稀土元素La含量的增加,焊点的硬度、弹性模量表现出明显的增长趋势,而且抗蠕变性能随着铼含量的上升呈线性上升趋势. With the development of electronic industry,micro solder joints require higher and higher reliability. The Sn-0. 3Ag-0. 7Cu-x La joints were obtained by reflow soldering,with Sn-0. 3Ag-0. 7Cu as the substrate and different contents of La.The effect of La on nano mechanical properties of the soldered joints was studied. The mechanical performance parameters of joints,nano indentation hardness H, elastic modulus E and creep strain rate sensitivity index m,were obtained through Ma geophysical inverse analysis method based on the force-depth data. The results show that the values of hardness and elastic modulus had an obvious tendency of increase with the increase of La content. And the creep resistance of solder joints was improved with the increase of La content.
出处 《焊接学报》 EI CAS CSCD 北大核心 2015年第9期75-78,117,共4页 Transactions of The China Welding Institution
基金 黑龙江省自然科学基金资助项目(E201449)
关键词 纳米压痕 稀土元素LA 力学性能 蠕变敏感指数 nano-indentation rare earth element La mechanical property creep sensitive index
  • 相关文献

参考文献8

二级参考文献50

  • 1卢斌,王娟辉,栗慧,朱华伟,焦宪贺.添加0.10%Ce对Sn-0.7Cu-0.5Ni焊料与Cu基板间界面IMC的影响[J].中国有色金属学报,2007,17(3):390-395. 被引量:22
  • 2张启运.无铅钎焊的困惑、出路和前景[J].焊接,2007(2):6-10. 被引量:21
  • 3Anderson I E.Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloysfor Pb-free electronic solder applications[J].Journal of MaterialsScience-Materials in Electronics,2007,18(1-3):55-76.
  • 4Moon K W,Boettinger W,Kattner U,et al.Experimental andthermodynamic assessment of Sn-Ag-Cu solder alloys[J].Journalof Electronic Materials,2000,29(10):1122-1136.
  • 5Ohnuma I,Miyashita M,Anzai K,et al.Phase equilibria andthe related properties of Sn-Ag-Cu based Pb-free solder alloys[J].Journal of Electronic Materials,2000,29(10):1137-1144.
  • 6Kang S,Shih D Y,Donald N Y,et al.Ag3Sn plate formation inthe solidification of near-ternary eutectic Sn-Ag-Cu[J].JOMJournal of the Minerals,Metals and Materials Society,2003,55(6):61-65.
  • 7Chinnam R K,Fauteux C,Neuenschwander J,et al.Evolutionof the microstructure of Sn-Ag-Cu solder joints exposed to ultra-sonic waves during solidification[J].Acta Materialia,2011,59(4):1474-1481.
  • 8Kang S K,Shih D Y,Leonard D,et al.Controlling Ag3Sn plateformation,in near-ternary-eutectic Sn-Ag-Cu solder by minor Znalloying[J].Journal of the Minerals,Metals and Materials Socie-ty,2004,56(6):34-38.
  • 9Cheng F,Nishikawa H,Takemoto T.Microstructural and me-chanical properties of Sn-Ag-Cu lead-free solders with minor ad-dition of Ni and/or Co[J].Journal of Materials Science,2008,43(10):3643-3648.
  • 10Song J M,Huang C F,Chuang H Y.Microstructural characteris-tics and vibration fracture properties of Sn-Ag-Cu-TM(TM=Co,Ni,and Zn)alloys[J].Journal of Electronic Materials,2006,35(12):2154-2163.

共引文献33

同被引文献80

引证文献5

二级引证文献10

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部