摘要
以Sn-3.5%Ag-x Bi(x=0wt%、2wt%、3.5wt%、5wt%和7 wt%)为研究对象,通过润湿性试验和剪切试验探索了Bi含量对焊料润湿性和接头剪切强度的影响。结果表明,随着Bi含量的增大,Sn-3.5%Ag-x Bi焊料润湿角减小,润湿性能得到一定的提高。随着Bi含量的增加,钎焊接头剪切强度先是增大,然后减小,Bi含量为5%时剪切强度最大;当Bi含量从0增加到5%时,接头剪切强度明显增加。
The effects of Bi content on the wettability and joint shear strength of Sn-3.5%Ag-xBi （x=0 wt%, 2 wt%, 3.5 wt%, 5 wt% and 7 wt%） lead-free solders were explored by wettability experiment and shear test. The results show that the wetting angles of Sn-3.5%Ag-xBi solders decrease and the wettability improves to a certain extent with the increase of Bi content. Meanwhile, with increasing Bi content, the joint shear strength firstly increases, and then decreases. When Bi content is 5%, the shear strength reaches the maximum. The shear strength of the welded joint increases significantly when Bi content increases from 0% to 5%.
出处
《热加工工艺》
CSCD
北大核心
2015年第23期218-220,共3页
Hot Working Technology
基金
博士专项基金资助项目(JZ2014HGBZ0031)
关键词
无铅焊料
润湿性
接头强度
lead-free solder
wettability
joint strength
