摘要
随着用户对产品的运算速度要求越来越高,产品所需器件的工作频率越来越高,使得高速PCB设计成为产品设计中一个重要的环节。高速信号和低速信号在PCB设计时,重点关注的设计因素有诸多不同。文中在对高速PCB设计多因素进行总结的同时,提出了一些具体的设计方法。提出的方法,对于高速PCB设计有不错的指导意义。
With userrs requirements for calculation speed of products becoming higher and higher, the frequency of the electronic equipment＇s devices is getting higher and higher,which makes the design of the high speed PCB become an important part of product design process. There are many different factors which we should focus on between low speed PCB design and high speed PCB design. With the summary of high speed PCB design factors, this paper puts forward some specific design methods which have great significance for high-speed PCB design.
出处
《通信电源技术》
2015年第6期41-44,共4页
Telecom Power Technology
关键词
高速电路
阻抗匹配
过孔设计
high speed circuit
impedance matching
via design
