摘要
采用模压成型工艺制备聚醚醚酮(PEEK)/铜粉导热复合材料,分析了Cu粉用量对PEEK/Cu复合材料导热系数、微观结构、结晶性能的影响。添加Cu粉后,复合材料的结晶温度降低,结晶速率加快;随Cu粉用量的增加,复合材料的导热系数升高。当Cu粉质量分数为20%时,导热系数提高100.9%。结果表明,添加Cu粉能有效地提高复合材料的导热性能。
PEEK/Cu thermally conductive composites were prepared by compression molding.The effects of Cu powder contents on the thermal conductivity,morphology,crystallization and mechanical properties of PEEK/Cu composites were studied.The crystallization temperature was declined and the crystallization rate was increased by adding Cu powder.The thermally conductivity of composites were increased gradually with the Cu powder content.The results showed that the thermally conductivity of PEEK/Cu composites were increased by 100.9% when Cu powder content was up to 20%,indicated that adding Cu powder could improve the performance of thermal conductivity of composite materials.
出处
《大连工业大学学报》
CAS
北大核心
2015年第4期263-266,共4页
Journal of Dalian Polytechnic University
基金
国家高技术研究发展计划资助项目(SS2015AA031601)
关键词
聚醚醚酮
铜粉
复合材料
导热
poly（ether-ether-ketone）
Cu powder
composites
thermally conductive
