摘要
介绍了电解铜箔的发展历程以及国内外的生产现状,并且指出随着电子产品小型化、薄型化和多功能化的发展趋势,对作为电子产品的主要基材之一的铜箔也提出了更高的要求,而目前国内电解铜箔在国际市场上的竞争力较弱,主要是受限于电解铜箔的生产工艺技术,尤其是表面处理工艺。文中针对近年来国内外在电解铜箔表面处理技术方面的研究进展进行分析,对高性能电解铜箔表面处理工艺未来的发展提出了展望。
After introducing the development of electrolyzing copper foil production status in domestic and abroad, it was pointed out that with the development trend of miniaturization of electronic equipment, as one of the main base material of electronic products, higher quality of the copper foil was required, and the competitive strength of current domestic electrolyzing copper foil in the international market was quite weak, which was urgently needed to be improved. The surface treatment technology of electrolyzing copper foil at home and abroad in recent years were reviewed and analyzed. The development of surface treatment technology for high-performance electrolyzing copper foil was put forward.
出处
《广州化工》
CAS
2016年第2期10-13,共4页
GuangZhou Chemical Industry
基金
江西省大学生创新创业项目(3103800005)
江西省教育厅研究生教学改革课题(JXYJG-2014-115)
关键词
电解铜箔
表面处理工艺
高性能
添加剂
electrolyzing copper foil
surface treatment
high-performance
additive
