摘要
采用4,4′-氧双邻苯二甲酸酐(ODPA),4,4′-二氨基二苯醚(ODA),1,10-二氨基葵烷(DDA)制备了热塑性聚酰亚胺(PI)薄膜。在300℃,25 MPa下用该薄膜与2层铜箔压合,并在400℃时隔绝空气60 min热处理,得到高尺寸稳定性的挠性覆铜板(FCCL)。利用电子万能试验机、差示扫描量热仪(DSC)、X射线衍射(XRD)、热力学分析(TMA)等对FCCL及PI薄膜的性能进行表征,并用扫描电镜(SEM)对FCCL剥离后2层内侧面进行观测。结果表明:热处理前后PI薄膜热分解温度均超过450℃,PI能与铜箔粘合良好,热处理后的FCCL,其剥离强度为0.9kN/m,内部的PI熔胶热膨胀系数(CTE)从7.7×10-5 K-1下降至1.7×10-5 K-1,,并能通过360℃焊锡浴测试。
Termoplastic polyimide films were synthesized with,4,4＇-diaminodiphenyl e- ther, 4,4＇-oxydiphthalic anhydride and 1,10-decanediamine. High dimensionally stable flex- ible copper clad laminate（FCCL） was manufactured by the films with two layers of copper foils at 300 ℃ ,25 MPa and then treated thermally for amother 1 hour in the absence of air at 400 ℃. The properties of the FCCL and the polyimide films were characterized by differ- ential scanning calorimetry（DSC）, electronic universal testing machine, thermo-mechanical analysis（TMA）, meanwhile the morphology of peeled inner 2 sides of the FCCL was ob- served by scanning electron microscope（SEM）. The results show that the thermal decom- position temperature of PI and thermally treated PI are both over 450 ℃. Polyimide can bond with copper foils perfectly. After thermal treatment, the peel strength of the FCCL is 0.9 kN/mm. The internal polyimide melt shows great decreasing in coefficient of ther- mal expansion （CTE） from 7.7 × 10^5K 1 tol 7 ×10-5 K-1 , in addition, 360 ℃ solder bath test of FCCL is qualified.
出处
《现代塑料加工应用》
CAS
北大核心
2016年第1期16-19,共4页
Modern Plastics Processing and Applications
基金
江苏高校优势学科建设工程资助项目
关键词
聚酰亚胺层压法
挠性爱铜板
无胶型
热处理低热膨胀系数
polyimide laminaton method
flexible copper clad laminate non-adhesive
thermal treatment
low thermal expansion coefficient
