摘要
以铜粉为基体材料,在反应体系中加入铜离子掩蔽剂,采用化学置换法在铜粉表面多次包覆银及多次高温致密化处理,实现了银在铜粉表面的连续致密包覆。用X-射线衍射法、扫描电子显微镜、透射电子显微镜和热质量分析的方法对银包铜双金属粉进行了表征。结果表明,铜粉表面的银包覆层致密性好、包覆完全,在800℃以下的抗氧化性能良好。
Copper-silver bimetallic powders were prepared based on copper powders as the matrix. In this process,silver was coated repeatedly on the surfaces of copper powders by a chemical replacement method with copper ionic masking agent. High-temperature densification process was used to realize the smooth and compact coating of silver on the surfaces of copper powders. Cu-Ag bimetallic powders were characterized by XRD,SEM,TEM and TG analysis. The results show a smooth and compact coating morphology of Cu-Ag bimetallic powders with excellent oxidation resistance below 800 ℃ is obtained.
出处
《电镀与精饰》
CAS
北大核心
2016年第4期14-17,共4页
Plating & Finishing
基金
贵州省社会发展科技攻关项目(黔科合SY字[2013]3121号)
关键词
铜银双金属粉
致密化处理
离子掩蔽剂
Cu-Ag bimetallic powders
densification
ionic masking agent
