摘要
介绍了CSP LED过渡衬底结构及其对可靠性的影响,分析了一种典型的CSP LED产品结构,并对结论进行实验验证。结果表明,该典型结构对热失配应力向芯片传递效果好。
This paper introduces the transition substrate structure of CSP LED and its effect on reliability. Thetypical LED CSP product structure is analyzed, and the analysis results are verified. The results show that thetypical structure has good effect on the thermal mismatch stress to the chip.
出处
《佛山科学技术学院学报（自然科学版）》
CAS
2016年第3期26-29,共4页
Journal of Foshan University(Natural Science Edition)
