摘要
为了解决低压成套设备新标准IEC 61439/GB 7251对温升验证所要求的最严酷布置问题,通过优化设计的方法求取最优解,得到PCC和MCC回路温升最严酷的一组布置。为相关技术人员确定温升试验的配置提供一种新方法。
In order to get the rigorous layout of low voltage assembly required by the temperature rise verification in new standard IEC6 1439 / GB 7251,through pursuing the best solution of optimization design,it gets a group of rigorous layout of PCC and MCC circuit,which can provide a new method of temperature rise verification for designer.
出处
《电器与能效管理技术》
2016年第4期73-75,共3页
Electrical & Energy Management Technology
关键词
低压成套设备
温升验证
优化设计
PCC
MCC
low voltage assembly
temperature rise verification
optimization design
PCC MCC
