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新型铜基结合剂金刚石锯片组织和性能的研究 被引量:2

Study on Microstructure and Properties of New Copper-matrix Bonding Diamond Saw-blade
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摘要 在新型铜基结合剂CSF中加入不同粉末,采用真空热压法和激光焊接法制成金刚石锯片,通过切削试验测定其切削性能,并结合扫描电子显微镜观察其显微组织。结果表明,由CSF烧结的金刚石锯片可顺利进行切削,且Fe、P等元素能一定程度提升结合剂的致密度和硬度;添加铬粉、钼粉的CSF结合剂对金刚石磨粒固着把持能力相比Fe、P-Fe等提升了40%左右,锯片的锋利度更高,切削性能最佳,且磨弧胎体的磨损与金刚石的磨损能保持较好匹配,使用寿命长,优于普通Cu-Sn刚石锯片。 Mixed with different powders in a new copper-matrix bonding CFS, diamond saw blade is prepared by vacuum hot pressing and laser beam welding, measuring its cutting performance by cutting test and observing its microstructure by scanning electron microscope. The results show that the new diamond saw-blade sintered by CSF can be smoothly cut, and to some extent Fe, P and some other elements can improve the density and hardness of the matrix; comparing with CSF added with Fe, P-Fe, CFS with chromium powder, molybdenum powder will increase the ability of diamond for graining, fixing and gripping by about 40%, making the sharpness of the saw blade greater and its cutting performance better. And the wear of its grinding arc block and diamond can maintain a good matching, so its service life is longer than ordinary Cu-Sn diamond saw-blade.
出处 《西昌学院学报(自然科学版)》 2016年第2期33-35,共3页 Journal of Xichang University(Natural Science Edition)
基金 四川文理学院科研项目(2014Z006Y)
关键词 铜基结合剂 金刚石锯片 走刀电流 显微组织 切削性能 copper-matrix bonding diamond saw-blade feed electric current microstructure cutting performance
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