摘要
杂散电感的存在会引起芯片关断损耗增大和过电压等现象,从而降低IGBT模块整体可靠性。通过分析IGBT模块工作回路杂散电感的分布并利用Ansoft Q3D Extractor对单独元件和模块整体进行仿真,发现模块的杂散电感主要来自于直流母排和导电铜层,虽然杂散电感随电路回路长度的增长而增加,但相对于回路长度,元件间的相对位置对杂散电感影响更大,通过元件的合理布局能显著降低模块整体的杂散电感。
Due to the existence of stray inductance, switching loss will increase and large voltage will spike during switching transients, which reduces the reliability level of IGBT modules. Based on analyzing the stray inductance in current circuit, Ansofl Q3D Extractor was used to calculate the stray inductance of individual component as well as integrated module. Results show that the stray inductance of module is mainly from DC bus and conductive copper layer, and longer circuit length will increase the stray inductance. On the other hand, compared with circuit length, the relative position of components has a major impact on the stray inductance. Stray inductance of IGBT modules can be significantly reduced by rational layout of components.
出处
《大功率变流技术》
2016年第4期30-33,共4页
HIGH POWER CONVERTER TECHNOLOGY
关键词
IGBT模块
杂散电感
数字仿真
元件布局
IGBT module
stray inductance
digital simulation
component layout
