摘要
简述了非金属基材化学镀前钯活化(包括胶体钯、纳米钯和离子钯活化)、无钯活化(主要有非贵金属胶体活化、离子镍活化和离子铜活化)和其他活化工艺(如激光辐射活化法、气相沉积活化法)的研究进展,总结了不同活化工艺的优势和不足,展望了非金属化学镀前活化工艺的发展趋势。
The research progress of palladium activation （including colloid palladium activation, nano-palladium activation and ionic palladium activation）, palladium-free activation （mainly including non-noble metal colloid activation, ionic nickel activation and ionic copper activation） and other activation processes （such as laser irradiation method and vapor deposition method） before electroless plating on nonmetallic substrates were reviewed. Both the advantages and disadvantages of various kinds of activation processes were summarized and the development trend of activation process for electroless plating on nonmetallic substrates was forecasted.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2016年第16期866-872,共7页
Electroplating & Finishing
关键词
非金属
化学镀
活化
钯
非贵金属
nonmetal
electroless plating
activation
palladium
non-noble metal
