期刊文献+

平板类微小型零件的移动位姿调整

Moving Posture Adjustment of Flat Type of Miniature Parts
下载PDF
导出
摘要 微小型零件移动位姿的精确定位及调整是微小型零件装配的关键。针对待装配微小型零件的特征,在搭建微装配平台的基础上,开发了相应的移动位姿识别算法,并利用高精密旋转电机实现了目标零件的位姿调整。具体方法为:对采集图像进行滤波、阈值分割、去噪以及亚像素边缘检测,得到目标零件的亚像素级边缘二值图像;利用最小二乘法线性拟合原理对提取的亚像素边界进行最小二乘直线拟合,得到待装配件与微装配系统X轴夹角;利用高精密旋转电机将待装配零件调整至与基体件偏角一致。实验结果表明,该方法能够很好地实现微小型零件的高精度位姿调整。 Precisely positioning and adjustmenting postue of the microminiature parts which is in the stage of moving is the key to successfully realize assembly. Through considering the characteristics of the microminiature parts,recognition algorithm of moving pose of the microminiature parts was developed on the basis of platform of micro-assembly system. At the same time,posture adjustment of the target parts was achieved by taking advantage of rotary motor which is highly precise. The specific method was shown as follows.Firstly,the image was processed by gaussian filter,threshold segmentation,denoising and subpixel edge detection to get the edge pixel level binary image of the target parts.Secondly,the principle of least squares linear fitting wsa used to deal with sub-pixel boundary to get the angle between the target part with X axis of micro-ssembly system. Finally,angle between target part with substrate part was adjusted to be parallel by using rotary motor with high precision.The experimental results show that the method can adjust posture of microminiature parts to be highlly precise very well.
机构地区 沈阳理工大学
出处 《仪表技术与传感器》 CSCD 北大核心 2016年第7期115-119,共5页 Instrument Technique and Sensor
基金 国家863计划资助项目(2009AA04Z167)
关键词 微装配 亚像素 最小二乘法 位姿调整 micro-assembly subpixel least square method posture adjustment
  • 相关文献

参考文献5

二级参考文献22

  • 1吴炯,张秀彬,张峰,门蓬涛,孙志旻.数字图像中边缘算法的实验研究[J].微计算机信息,2004,20(5):106-107. 被引量:77
  • 2张淑丽,张晔,何鹏,穆伟斌.图像处理中一种改进的边缘检测技术的研究与实现[J].齐齐哈尔医学院学报,2006,27(8):968-969. 被引量:3
  • 3陆建明,陈景波.交通监控系统中运动目标的检测与跟踪[J].电脑知识与技术,2006,1(12):161-162. 被引量:2
  • 4[1]J.Hesselbach," New Aspects of Microassembly", MICRO. tec2000 Proceedings Volume 2,DVE World Microtechnologies Congress,Sept.25- 27,2000,Hannover,Germany,45- 49.
  • 5[2]J.Hesselbach,M.Kü hn," Montage mikrosystemtechnischer Bauteile",Mikroelektronik+ Mikrosystemtechnik,9.
  • 6[3]J.Hesselbach,G.Pokar," A class of new robots for micro as sembly" ,Production Engineering,Vol.VII/1, 2000, 113- 116.
  • 7[4]J.Hesselbach,J.Plitea,N.Thoben," Advanced technologies for micro assembly",SPIE proceedings,Vol.3202,Pittsburg,USA, 1997, 178- 190.
  • 8[5]J.Hesselbach,A.Raatz," Pseudoelastic flexturehinges in robots for microassembly",SPIE proceedings, Vol.4194, Bosten,USA, 2000, 157- 167.
  • 9[6]J.Hesselbach,A.Raatz," Compliant parallel robot with 6 DOF" , SPIE proceedings,Vol.4568,Newton,USA, 2001, 143- 150.
  • 10[7]J.Hesselbach,R.Pittschellis," Mechnical grippers for microas sembly",Symposium on Handing and Assembly of Microparts, Vienna,November 1997,67- 72.

共引文献48

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部