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Cu-3.2Ni-0.75Si合金再结晶行为研究 被引量:1

Study on Recrystallization Behavior of Cu-3.2Ni-0.75Si Alloy
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摘要 对固溶态Cu-3.2Ni-0.75Si合金在二级变形+时效后进行了再结晶退火,研究了变形量对合金硬度、再结晶组织和再结晶动力学行为的影响。结果表明:在400℃退火时,变形量越大,再结晶速度越快;在不同温度退火时,变形量一定,退火温度越高,再结晶速度越快;在再结晶回复过程中,显微硬度和组织基本不变化;再结晶过程中显微硬度迅速下降,出现细小新晶粒并不断长大。经80%变形的合金软化温度为530℃,再结晶温度在500℃左右;在不同变形量退火时,40%变形量,合金发生再结晶的激活能为5.63 kJ/mol。再结晶的激活能随变形量的增加而降低,当变形量由40%增至80%时,再结晶激活能由5.63 kJ/mol降至4.17 kJ/mol。 The recrystallization annealing of Cu-3.2Ni-0.75Si alloy after solid solution+two-stage deformation+aging was performed. The influences of the deformation on the hardness, the recrystallization microstructure and recrystallization kinetics behavior of the alloy were studied. The results show that: during the annealing at 400 ℃, the greater the deformation is, the faster the recrystallization rate is. When annealing at different temperature and the same deformation, the higher the annealing temperature is, the faster the recrystallization rate is. In the recovery process of recrystallization, the micro-hardness and the microstructure do not change basically. In the recrystallization process, the microhardness decreases rapidly, and the new grains appear and grow unceasingly. After 80% deformation, the softening temperature of the alloy is 530 ℃, and the recrystallization temperature is at 500 ℃. During the annealing at different deformation, the recrystallization activation energy of the 40% deformation alloy is 5.63 kJ/mol. Recrystallization activation energy decreases with the increase of the deformation. When the deformation is increased from 40% to 80%, the recrystallization activation energy is decreased from 5.63 kJ/mol to 4.17 kJ/mol.
出处 《热加工工艺》 CSCD 北大核心 2016年第18期205-209,共5页 Hot Working Technology
基金 洛阳市科技发展项目(1401055A)
关键词 CU-NI-SI合金 冷轧 软化温度 再结晶激活能 Cu-Ni-Si alloy cold rolling softening temperature recrystallization activation energy
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