摘要
基于Taguchi试验设计，采用L16（45）正交表进行试验设计，对液晶聚合物（LCP）微连接器的注塑成型过程进行数值模拟分析，研究工艺参数对制品翘曲变形的影响规律。结果表明：熔体温度对翘曲变形的影响作用较大。温度越高翘曲变形越小，属于显著性影响因素；保压时间对翘曲变形影响最小，属于非显著性因素。
Based on Taguchi experimental method and using a L16 （45） orthogonal array, the numerical simulation was carried out for injection molding process of LCP micro connector. Moreover, the influence of processing parameters on warpage was discussed. Results showed that the warpage was decreased with the increasing of the melt temperature and the melt temperature was a notable factor. Meanwhile,the holding time had a very limited influence on warpage.
出处
《塑料》
CAS
CSCD
北大核心
2016年第5期5-8,共4页
Plastics
基金
国家自然科学基金青年科学基金资助(51203010)
